High cleanliness: high purity, no static electricity, suitable for high cleanliness scenes such as semiconductors.
Precision adsorption: The surface roughness is low (Ra≤0.1μm), the micropores are uniform, the adsorption force error is <±2%, and the workpiece has no slip deformation.
Corrosion resistance: strong acid, alkali and plasma resistance, suitable for dry etching process.
High strength and wear resistance: 99% alumina sintered at high temperature, hardness 1600Hv, long life.
High temperature resistance: high temperature resistance above 300℃, thermal expansion coefficient close to silicon, small thermal deformation.
Good insulation: volume resistivity> 10 µ Ω·cm, avoid micro-short circuit.
Customizable: adjust grain/porosity to suit different process requirements.
Environmental protection and energy saving: reduce chemical pollution, partial self-adsorption saves energy consumption.
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