Precision alignment and protection: the accuracy of the bump array is ±2µm, the alignment error is ≤5µm, and the flexible buffer structure avoids bump damage (damage rate <0.01%).
High temperature resistance and stability: resistant to high temperature of 450℃, built-in temperature control system (uniformity±1.5℃), thermal expansion coefficient matching chip, reduce welding stress.
High cleanliness and anti-pollution: particle release <0.3pcs /cm2, resistant to flux corrosion, easy to clean surface, suitable for high-clean packaging environment.
High strength and long life: The flexural strength is ≥450Mpa, the wear is <5µm after 2 million cycles, and the vacuum sealing is excellent (the leakage rate is extremely low).
Multi-function integration: adjustable electrostatic control, air flow assistance, compatible with multi-size bumps (50µm-500µm spacing), suitable for advanced packaging technology.
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