Performance advantages: high hardness (Vickers hardness over 2000HV, wear resistance), high strength (bending resistance, not easy to deform), high temperature resistance (melting point over 2000℃, suitable for high temperature scenarios), corrosion resistance (acid and alkali resistance, etc., suitable for complex environments), good insulation (no electrostatic interference, protection components).
Precision and cleanliness: high size precision (up to ±0.001mm), smooth surface (Ra as low as 0.1), no metal ion precipitation, less particle shedding, suitable for semiconductor and other high cleanliness requirements.
Application adaptation: lightweight (density lower than metal) flexible, customizable shape/structure, used for semiconductor wafer handling, precision machining and other scenarios, relatively high cost performance.
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