Air transfer: Bernoulli airflow, do not touch the wafer, anti-scratch, pollution, only transfer thin and fragile.
Conducting static electricity: with antistatic design (coating/conductive structure), conducting static electricity in time, no "sticky sheet", less fragments.
Ceramic hard: aluminum oxide, wear resistance, high temperature resistance, corrosion resistance, with a long time also stable, do not drop slag pollution.
Accuracy: small thermal expansion and contraction, small positioning error, accurate handling and placement of chips during chip manufacturing.
Wide range of scenarios: vacuum, high temperature, corrosive semiconductor processes (photolithography, etching, etc.)
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