Air handling: Bernoulli airflow, no contact with wafers, scratch prevention, pollution prevention, special handling of thin and fragile.
Ceramic steel: aluminum oxide material, hard, high temperature resistance, corrosion resistance, with a long time also does not deform, do not drop slag.
Super clean: ceramic dense, no impurities, no static electricity, semiconductor clean environment with confidence.
Precision stability: small thermal expansion and contraction, accurate processing, small positioning error of moving things, stable chip manufacturing.
Wide scene: vacuum, high temperature, corrosive semiconductor process (photolithography, etching, etc.), can withstand.
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