Bernoulli arm

Non-contact handling: Bernoulli airflow adsorption, do not touch the wafer, anti-scratch, pollution, adapt to thin/brittle workpieces.

Ceramic strong performance: alumina material hard, wear resistance, high temperature resistance, corrosion resistance, long-term use of non-deformation, non-slag.

Ultra-clean low disturbance: ceramic compact, no impurity precipitation, less particles, no static electricity, meet the requirements of semiconductor cleanliness.

Accuracy and stability: low thermal expansion coefficient, stable size when temperature changes, small handling positioning error, and ensure chip yield.

Wide scene adaptation: stable operation in vacuum, high temperature, corrosive environment (photolithography/etching, etc.), covering semiconductor multi-process.