Common problems and solutions of semiconductor ceramic products

In the process of using semiconductor ceramic products, some difficult problems are often encountered. Taking the aluminum nitride ceramic heating plate as an example, because of its high hardness and brittleness, it is extremely difficult to process. It is difficult for traditional cutting tools to process it, and advanced tools such as diamond grinding wheels are required, but even so, defects such as chipping and fracture are still prone to processing, which seriously affects the yield and quality. Moreover, the aluminum nitride ceramic heating disc has extremely high accuracy requirements. The straightness of the heating disc with a length of 100mm needs to be controlled at 0.1mm, and the straightness of the heating disc with a length of 300mm needs to be controlled within 0.3mm. This makes the processing process need to be finely controlled and calibrated. At the same time, due to the use of a large number of expensive diamond grinding wheels and other tools, and the need to be polished and ground multiple times to achieve a mirror effect, the processing cost remains high and the efficiency is low.

In response to these problems, the industry has explored effective solutions. Using a ceramic engraving and milling machine, its high-speed spindle and fast feed system can achieve efficient processing. With advanced tool technology and cooling system, it can ensure the quality of the processed surface and improve the processing efficiency and yield. The use of precision machining techniques in the processing process, such as diamond grinding wheel grinding, grinding and polishing, can ensure that the surface roughness, dimensional accuracy and shape accuracy of the heating disc are up to standard. Strict quality control and testing are also indispensable. Advanced equipment such as three-coordinate measuring instruments and laser rangefinder are used to monitor and feedback all aspects of processing in real time, correct problems in time, and ensure product quality.

Similarly, in the application of semiconductor ceramic discs, alumina ceramic tubes, microporous ceramic vacuum suction cups and other products, problems such as ceramic disc surface wear affecting wafer positioning accuracy, alumina ceramic tube connection sealing problems, microporous ceramic vacuum suction cup adsorption attenuation and so on will be encountered. To solve these problems, we need to start from material selection, manufacturing process optimization, daily maintenance and other aspects to ensure the stable and efficient operation of semiconductor ceramic products in the semiconductor industry and other industrial fields.