Precise Positioning: High-precision processing (extremely small tolerances) to firmly fix the display substrate / optical film, ensuring perfect alignment of circuits / layers during photolithography and lamination, preventing image misalignment and color differences.
Electrical / Thermal Isolation: Naturally insulating (non-conductive), slow thermal conductivity (heat-insulating), it blocks circuit interference and reduces thermal crosstalk in Mini/Micro LED backlights and OLED packaging, maintaining uniform display brightness and stable colors.
Flexible Adaptability: Customizable dimensions, slotting / punching structures, matching the substrate, film, and chip carrier requirements of different display processes (LCD/OLED/Micro LED), with strong versatility.
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