
1. No contact with wafers, zero damage
Support wafer with airflow (non-contact), no scratch, especially suitable for thin/sensitive chips, less dust, clean enough.
2. Antistatic and insulating
Ceramic itself is non-conductive, anti-electrostatic discharge; surface can be treated to conduct static electricity, not afraid of airflow friction and accumulation.
3. High temperature resistance, corrosion resistance
Can withstand 1200℃ high temperature (such as heat treatment process), do not react with acid and alkali, plasma, long-term use without deformation, not corroded.
4. move accurately and steadily
Airflow adjustment, micron suspension height, wafer does not shake (shaking <0.1mm); thermal expansion and contraction are small, positioning error is small (±0.005mm).
