Adapt: ring structure, fit cavity space, adapt wafer processing flow.
Resistance: ceramic material, withstand high temperature, plasma corrosion, insulation or stable electricity transmission.
Precision: uniform distribution of small holes, so that the process gas evenly dispersed, to ensure wafer processing consistency.
Stability: high cleanliness, not easy to contaminate wafers; long-term use, stable size and performance, equipment does not stop
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