Accurate positioning: strip shape + porous/precise processing, adapt to the linear installation/transportation requirements of photovoltaic production line silicon wafers and battery modules, ensure millimeter alignment accuracy during cutting, welding and lamination through pins and slots, and prevent workpiece deviation and dislocation.
Extreme environment resistance: zirconia melting point exceeds 2700℃, can withstand photovoltaic high temperature process (silicon wafer sintering, battery annealing>800℃), also resistant to hydrofluoric acid, nitric acid and other acid and alkali corrosion (velvet, cleaning process), long-term use without deformation, not eroded, adapted to "high temperature-chemical treatment" cycle.
Super wear and impact resistance: zirconia toughness/high hardness (fracture toughness 3 - 6 MPa·m ²/2, hardness>1200 HV), in photovoltaic silicon wafer cutting (high speed sand line friction), component handling (mechanical arm high frequency grab), wear resistance, crack resistance, life is much better than metal/plastic parts.
Clean and low disturbance: ceramic compact and non-porous, no adsorption of impurities, no release of particles, in line with photovoltaic silicon wafer surface "ultra-clean"(particles <50nm) requirements, to prevent pollution silicon wafer, reduce battery short circuit, low efficiency and other defective rate.
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