LCD/OLED panel process: As a substrate carrier platform, it precisely fixes the glass substrate during photoresist coating, exposure, and development processes, ensuring the accuracy of TFT circuits and color film patterns.
Optical film assembly: Supports and positions polarizers, brightness enhancement films, etc., maintaining consistent film layer spacing to enhance display brightness and contrast uniformity.
High-end display packaging: In COF (chip-on-flexible substrate) bonding and Micro LED massive transfer equipment, it provides a clean and stable 承载 surface, ensuring the reliability of chip / circuit connections.
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